JPH0124612B2 - - Google Patents

Info

Publication number
JPH0124612B2
JPH0124612B2 JP56088282A JP8828281A JPH0124612B2 JP H0124612 B2 JPH0124612 B2 JP H0124612B2 JP 56088282 A JP56088282 A JP 56088282A JP 8828281 A JP8828281 A JP 8828281A JP H0124612 B2 JPH0124612 B2 JP H0124612B2
Authority
JP
Japan
Prior art keywords
mold
molding
gate
vent
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56088282A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57203532A (en
Inventor
Kazuo Nagai
Tadayuki Ozawa
Kazuyuki Kaminari
Takeshi Oono
Nagao Noguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Original Assignee
Toshiba Chemical Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd filed Critical Toshiba Chemical Products Co Ltd
Priority to JP8828281A priority Critical patent/JPS57203532A/ja
Publication of JPS57203532A publication Critical patent/JPS57203532A/ja
Publication of JPH0124612B2 publication Critical patent/JPH0124612B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0061—Moulds or cores; Details thereof or accessories therefor characterised by the configuration of the material feeding channel
    • B29C33/0066—Moulds or cores; Details thereof or accessories therefor characterised by the configuration of the material feeding channel with a subdivided channel for feeding the material to a plurality of locations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B29C45/2708—Gates
    • B29C2045/2712—Serial gates for moulding articles in successively filled serial mould cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
    • B29C67/246—Moulding high reactive monomers or prepolymers, e.g. by reaction injection moulding [RIM], liquid injection moulding [LIM]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP8828281A 1981-06-10 1981-06-10 Mold for molding thermosetting resin Granted JPS57203532A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8828281A JPS57203532A (en) 1981-06-10 1981-06-10 Mold for molding thermosetting resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8828281A JPS57203532A (en) 1981-06-10 1981-06-10 Mold for molding thermosetting resin

Publications (2)

Publication Number Publication Date
JPS57203532A JPS57203532A (en) 1982-12-13
JPH0124612B2 true JPH0124612B2 (en]) 1989-05-12

Family

ID=13938539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8828281A Granted JPS57203532A (en) 1981-06-10 1981-06-10 Mold for molding thermosetting resin

Country Status (1)

Country Link
JP (1) JPS57203532A (en])

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62122254A (ja) * 1985-11-22 1987-06-03 Mitsubishi Electric Corp 樹脂モ−ルド半導体装置用フレ−ム
JPS63164453A (ja) * 1986-12-26 1988-07-07 Idec Izumi Corp 小型電子部品の連結体の製造方法
JPH0258344A (ja) * 1988-08-24 1990-02-27 Rohm Co Ltd リードフレームに対するモールド部の成形装置
ATE209088T1 (de) * 1994-09-21 2001-12-15 Seikisui Chemical Co Ltd Verfahren zum herstellen von kugelförmigen gegenständen
US6316821B1 (en) * 1998-09-28 2001-11-13 Cypress Semiconductor Corporation High density lead frames and methods for plastic injection molding
WO2006129926A1 (en) * 2005-06-02 2006-12-07 Tsp Co., Ltd. Mold for manufacturing semiconductor device and semiconductor device manufactred using the same
US7691315B2 (en) 2005-07-18 2010-04-06 T.F.H. Publications, Inc. Injection mold having cavities in series
JP2012030536A (ja) * 2010-07-30 2012-02-16 Toshiba Corp 注形用金型及びガス絶縁開閉装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5228554A (en) * 1975-08-30 1977-03-03 Matsushita Electric Works Ltd Method of molding products by picking up multiple blanks

Also Published As

Publication number Publication date
JPS57203532A (en) 1982-12-13

Similar Documents

Publication Publication Date Title
JPH0124612B2 (en])
JPH08213416A (ja) 半導体装置用リ−ドフレ−ム及びこれを用いるモ−ルド装置
JPH06177305A (ja) スロット付き導線フレーム及び集積回路パッケージを成形する方法
US6428731B1 (en) Mould part, mould and method for encapsulating electronic components mounted on a carrier
JP4202632B2 (ja) 一括封止型半導体パッケージの樹脂封止構造およびその製造装置
JPS622456B2 (en])
JP2004319900A (ja) 樹脂封止用型及び樹脂封止用型の仕様決定方法
JPH05335442A (ja) 半導体装置の樹脂モールド方法
JPS635538A (ja) 樹脂封止形半導体装置の成形用金型
JPS5933838A (ja) 半導体樹脂封止用金型装置
JP3394463B2 (ja) 樹脂封止型半導体装置のモールド金型及びそのリードフレーム
JPH0637231A (ja) リードフレームおよびそれを用いたレジンモールド形半導体装置
JP3499269B2 (ja) カバーフレームと樹脂封止方法
JPS5854659A (ja) 樹脂封止型半導体装置
JPS61215028A (ja) モ−ルド金型およびそれを用いた半導体装置の製造方法
JPH05136191A (ja) 半導体素子樹脂封止用金型
JPS59165636A (ja) 樹脂封止用金型
JPH02271641A (ja) 半導体装置の製造方法およびモールド型ならびにリードフレーム
JPS6324649A (ja) 半導体集積回路用リ−ドフレ−ム
JPH0379319A (ja) モールド用金型
JPH07178762A (ja) 樹脂成形方法および樹脂成形用金型
JPH087632Y2 (ja) 半導体装置用樹脂封止金型
JP2742650B2 (ja) 半導体素子が搭載されたリードフレームの樹脂封止用モールド金型
JPH04167440A (ja) 半導体製造装置のモールド金型
JPH06204384A (ja) 半導体用リードフレーム